| PART |
Description |
Maker |
| F2224-11M F2224-11P F2224-11S F2224-14 F2224-14M F |
Circular MCP and assembly series. For analytical instruments, electron tibe, cosmic measurement, high energy physics
|
Hamamatsu Corporation
|
| F2223-21SH |
MCP ASSEMBLY
|
Hamamatsu Photonics
|
| AM50DLI28BG AM50DL128BG |
Am50DL128BG - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Am50DL128BG -堆叠式多芯片封装（MCP）闪存和SRAM
|
Advanced Micro Devices, Inc.
Spansion, Inc.
|
| S72WS-N S72WS512NEG-LY S72WS512NFG-LY S72WS512NFG- |
Based MCP/PoP Products 基于MCP流行产品
Based MCP/PoP Products SPECIALTY MEMORY CIRCUIT, PBGA137
|
Spansion Inc.
Spansion, Inc.
|
| S2HVM2.5 S2HVM10 S2HVM12.5 S2HVM15 S2HVM7.5 S2HVM5 |
STANDARD RECOVERY HIGH VOLTAGE RECTIFIER ASSEMBLY
High Voltage,High Density, Standard Recovery Rectifier Assembly(反向电压2500V，高压，高密度，标准恢复整流器部
High Voltage,High Density, Standard Recovery Rectifier Assembly(反向电压12500V，高压，高密度，标准恢复整流器部
High Voltage,High Density, Standard Recovery Rectifier Assembly(反向电压7500V，高压，高密度，标准恢复整流器部
|
http://
Semtech Corporation
|
| AM50DL128BH56I AM50DL128BH70I AM50DL128BH70IS |
Circular Connector; No. of Contacts:56; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装（MCP）闪存和SRAM
|
Advanced Micro Devices, Inc.
|
| AM41DL32X4GT85IS AM41DL32X4GT85IT AM41DL32X4GB85IT |
SPECIALTY MEMORY CIRCUIT, PBGA73
Circular Connector; No. of Contacts:41; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:21; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No 堆叠式多芯片封装（MCP）闪存和SRAM
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Spansion, Inc.
Advanced Micro Devices
|
| S4KW12KA-3 S4KW4KA-1 S4KW24KA-6 S4KW8KA-2 |
High Voltage,High Current,Standard Recovery Rectifier Assembly(反向电压12000V，高压，大电流，标准恢复整流器部 高电压，大电流，标准恢复整流大会（反向电2000V，高压，大电流，标准恢复整流器部件）
High Voltage,High Current,Standard Recovery Rectifier Assembly(反向电压8000V，高压，大电流，标准恢复整流器部
STANDARD RECOVERY HIGH VOLTAGE, HIGH CURRENT RECTIFIER
|
Semtech Corporation
|
| A82DL3234 A82DL3244 A82DL3224UG-70 A82DL3224TG-70 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装（MCP）闪存和SRAMA82DL32x4T（ü）32兆位Mx8 Bit/2Mx16位）的CMOS 3.3伏只，同时闪电行
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装（MCP）闪存和SRAM，A82DL32x4T（ü）32兆位Mx8 Bit/2Mx16位）的CMOS 3.3伏只，同时闪电行
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装（MCP）闪存和SRAM，A82DL32x4T（ü）32兆位4Mx8 Bit/2Mx16位）的CMOS 3.3伏只，同时闪电行
|
AMIC Technology, Corp.
AMIC Technology Corporation
|
| FAJAE-404 FRJAE-404 FAJAE-406 FAJAE-416 FRJAE-402 |
FRJAE ASSEMBLY, 6 POSITION AND 8 POSITION
FRJAE ASSEMBLY 6 POSITION & 8 POSITION WITH OR WITH OUT FERRITES SINGLE PORT HIGH TEMP MATERIAL
|
Amphenol Corporation
|
